creat by art - low power loss, high efficiency - guardring for overvoltage protection - high surge current capability - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 base p/n with suffix "g" on packing code - halogen-free terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test symbol unit v rrm v v rms v v dc v i f(av) a dv/dt v/ s r jc o c/w t j o c t stg o c document number: ds_d1310018 version: e13 note 1: pulse test with pw=300 s, 1% duty cycle mbri20100ct 100 70 100 0.85 0.75 0.95 0.85 5 typical thermal resistance 2 operating junction temperature range - 55 to +150 storage temperature range - 55 to +150 ma voltage rate of change (rated v r ) 10000 maximum reverse current @ rated vr t j =25 t j =125 i r 0.1 v maximum instantaneous forward voltage (note 2) i f = 10 a, t j =25 i f = 10 a, t j =125 i f = 20 a, t j =25 i f = 20 a, t j =125 v f peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 150 a maximum dc blocking voltage maximum average forward rectified current 20 maximum repetitive peak reverse voltage maximum rms voltage weight: 1.7 g (approximately) maximum ratings and electrical characteristics (t a =25 unless otherwise noted) parameter i 2 pak mechanical data case: i 2 pak polarity: as marked mbri20100ct dual common cathode schottk y rectifier features - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec taiwan semiconductor
part no. part no. mbri20100ct mbri20100ct (ta=25 unless otherwise noted) document number: ds_d1310018 version: e13 example ratings and characteristics curves mbri20100ct taiwan semiconductor mbri20100ct c0 c0 mbri20100ct c0g c0 g preferred p/n packing code green compound code green compound description 50 / tube packing ordering information mbri20100ct c0 suffix "g" i 2 pak packing code green compound code package 0 5 10 15 20 25 0 255075100125150175 average forward current (a) case temperature ( ) fig.1 maximum forward current derating curve resistive or inductive load with heatsink 0 25 50 75 100 125 150 110100 peak forward surge current(a) number of cycles at 60 hz fig. 2 maximum non-repetitive forward surge current per leg 8.3ms single half sine wave jedec method 0.0001 0.001 0.01 0.1 1 10 0 20406080100120140 instantaneous reverse current (ma) percent of vr (%) fig. 4 typical reverse characteristics per leg tj=25 tj=125 tj=75 0.1 1 10 100 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 instantaneous forward current (a) forward voltage (v) fig. 3 typical forward characteristics per leg tj=125 tj=25
min max min max a - 10.50 - 0.413 b 3.56 4.06 0.140 0.160 c 0.68 0.94 0.027 0.037 d 14.60 15.88 0.575 0.625 e 7.58 8.12 0.298 0.320 f 2.41 2.67 0.095 0.105 g 4.44 4.70 0.175 0.185 h 1.14 1.40 0.045 0.055 i 1.14 1.40 0.045 0.055 j 8.25 9.25 0.325 0.364 k 2.54 2.79 0.100 0.110 l 0.35 0.64 0.014 0.025 p/n = marking code g = green compound yww = date code f = factory code document number: ds_d1310018 version: e13 marking diagram mbri20100ct taiwan semiconductor package outline dimensions dim. unit (mm) unit (inch) 0.1 1 10 100 0.01 0.1 1 10 100 transient thermal impedance( / w) t-pulse duration(s) fig. 6 typical transient thermal impedance per leg 10 100 1000 0.1 1 10 100 capacitance (pf) reverse voltage (v) fig. 5 typical junction capacitance f=1.0mhz vsig=50mvp-p
creat by art assumes no responsibility or liability for any errors inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1310018 version: e13 mbri20100ct taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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